Oct 8 (Reuters) – GlobalFoundries on Thursday said it has reached a $2 billion agreement to make a key component used to link AI processors and memory chips for TSMC at its New York facility.
Known as a silicon interposer, the component sits beneath processors and memory chips inside advanced AI packages and enables them to communicate at high speeds.
• Under the five-year agreement, GlobalFoundries will expand manufacturing capacity at its Malta, New York, facility to produce the components for TSMC
• The Malta facility is expected to become the first US-based source of silicon interposers used in advanced chip-packaging technologies, the company said
• Shares of GlobalFoundries were up about 4% in premarket trading
• The deal provides a framework for future capacity expansion as demand for advanced packaging grows, with volume production expected to begin ramping up in the first half of 2028
• Advanced packaging has become a major constraint on AI chip production, as demand for the technology exceeds available manufacturing capacity
(Reporting by Prathik Jayaprakash in Bengaluru; Editing by Jonathan Ananda)
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